Packaging structure for a sensor having a sealing layer

ABSTRACT

According to an aspect, a sensor packaging structure includes a sensor die having a first surface and a second surface opposite the first surface, where the sensor die defines a sensor edge disposed between the first surface and the second surface. The sensor packaging structure includes a bonding material having a first surface and a second surface opposite the second surface, where the bonding material defines a bonding material edge disposed between the first surface of the bonding material and the second surface of the bonding material. The sensor packaging structure includes a transparent material, where the bonding material couples the sensor die to the transparent material. The sealing material is disposed on an interface between the sensor die and the bonding material, and at least one of a portion of the sensor edge or a portion of the bonding material edge.

TECHNICAL FIELD

This description relates to a package structure for a sensor having asealing layer.

BACKGROUND

A sensor packing structure may protect the sensor from moisture.However, in some applications, moisture may still leak through thepackage and interfere with the operations of the sensor.

SUMMARY

According to an aspect, a sensor packaging structure includes a sensordie having a first surface and a second surface opposite the firstsurface, where the sensor die defines a sensor edge disposed between thefirst surface and the second surface. The sensor packaging structureincludes a bonding material having a first surface and a second surfaceopposite the second surface, where the bonding material defines abonding material edge disposed between the first surface of the bondingmaterial and the second surface of the bonding material. The sensorpackaging structure includes a transparent material, where the bondingmaterial couples the sensor die to the transparent material, and asealing material including one or more layers. The sealing material isdisposed on an interface between the sensor die and the bonding materialat an edge portion of the sensor packaging structure, and at least oneof a portion of the sensor edge or a portion of the bonding materialedge.

According to some aspects, the sensor packaging structure may includeone or more of the following features or any combination thereof. Thesealing material may include a metal layer. The sealing material mayinclude a passivation layer and a metal layer. The transparent materialincludes a first surface and a second surface, where at least a portionof the second surface of the sensor die contacts the first surface ofthe bonding material. At least a portion of the sealing material mayextend along a portion of the first surface of the sensor die. Thesealing material may also be disposed on an interface between thetransparent material and the bonding material. The sealing material mayextend along the sensor edge, the interface between the sensor die andthe bonding material, the bonding material edge, the interface betweenthe bonding material and the transparent material, and a transparentmaterial edge of the transparent material. The sensor die may includeone or more vias.

According to an aspect, a sensor packaging structure includes a sensordie having a first surface and a second surface, where the sensor diedefines a sensor edge disposed between the first surface and the secondsurface. The sensor packaging structure includes a transparent materialcoupled to the sensor die, where the transparent material has a firstsurface and a second surface, and the transparent material defines atransparent material edge disposed between the first surface and thesecond surface. The sensor packaging structure includes a sealingmaterial including one or more layers. The sealing material is disposedon an interface between the sensor die and the transparent material atan edge portion of the sensor packaging structure, and at least one of aportion of the transparent material edge or a portion of the sensoredge.

According to some aspects, the sensor packaging structure may includeone or more of the above and/or below features (or any combinationthereof). The transparent material may include a single layer oftransparent material. The transparent material may include a first layerof transparent material and a second layer of transparent material, andthe sealing material is disposed on an interface between the sensor dieand the first layer of transparent material, and the sealing material isdisposed on an interface between the sensor die and the second layer oftransparent material. The sensor packaging structure may include abonding material disposed between the sensor die and the transparentmaterial to couple the sensor die to the transparent material, where thesealing material is disposed on an interface of the sensor die and thebonding material. The sealing material may be disposed on an interfaceof the bonding material and the transparent material. The sensor die maybe directly connected to the transparent material. The sealing materialmay include a metal layer. The sealing material may include apassivation layer and a metal layer. The passivation layer may includesolder mask material. The sensor die may include one or more vias.

According to an aspect, a method for fabricating a sensor packagingstructure includes coupling a sensor die to transparent material using abonding material, processing the sensor die including forming one ormore vias through the sensor die, and disposing a sealing material on atleast one of a first interface or a second interface, where the firstinterface is between the sensor die and the bonding material, and thesecond interface is between the bonding material and the transparentmaterial, the sealing material including a metal layer. In someexamples, the disposing the sealing material includes disposing apassivation layer on at least one of the first interface or the secondinterface, and disposing the metal layer on the passivation layer.

The details of one or more implementations are set forth in theaccompanying drawings and the description below. Other features will beapparent from the description and drawings, and from the claims.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1A illustrates a sensor packaging structure according to an aspect.

FIG. 1B illustrates a sensor packaging structure with a sealing materialapplied on an edge portion of the sensor packaging structure accordingto an aspect.

FIG. 1C illustrates a sensor packaging structure with a sealing materialapplied on an edge portion of the sensor packaging structure accordingto another aspect.

FIG. 2A illustrates an example of a transparent material of a sensorpackaging structure according to an aspect.

FIG. 2B illustrates a sealing material disposed on an edge of thetransparent material according to an aspect.

FIG. 3A illustrates a sensor packaging structure according to an aspect.

FIG. 3B illustrates a sensor packaging structure with a sealing materialapplied on an edge portion of the sensor packaging structure accordingto an aspect.

FIG. 3C illustrates a sensor packaging structure according to an aspect.

FIG. 3D illustrates a sensor packaging structure with a sealing materialapplied on an edge portion of the sensor packaging structure accordingto an aspect.

FIG. 4A illustrates a sensor packaging structure according to an aspect.

FIG. 4B illustrates an edge portion of the sensor packaging structureaccording to an aspect.

FIG. 5 illustrates an edge portion of a sensor packaging structureaccording to another aspect.

FIG. 6A illustrates a flowchart depicting example fabrication operationsfor a sensor packaging structure according to an aspect.

FIG. 6B illustrates a flowchart depicting example fabrication operationsfor the sensor packaging structure according to an aspect.

FIG. 7 illustrates a flowchart depicting example fabrication operationsfor the sensor packaging structure according to an aspect.

DETAILED DESCRIPTION

The present disclosure relates to a sensor packaging structure that mayinclude a sensor die, a bonding material, and a transparent member. Insome examples, the sensor die includes an image sensor die. Thetransparent member may be coupled to the sensor die using the bondingmaterial. In some applications, moisture may enter through an interfacebetween the sensor die and the bonding material and/or an interfacebetween the bonding material and the transparent member. However, thesensor packaging structure includes a sealing material that covers theinterface between the sensor die and the bonding material and/or theinterface between the bonding material and the transparent member at theedge portion of the sensor packaging structure. In some examples, thesealing material includes one or more layers. In some examples, thesealing material includes a metal layer. In some examples, the sealingmaterial includes a passivation layer and a metal layer. In someexamples, the sensor packaging structure includes the sensor die and thetransparent member. In some examples, the sensor die is coupled directlyto the transparent member (e.g., without the bonding material). In someexamples, the sealing material may be disposed on an interface betweenthe sensor die and the transparent member at the end portion of thesensor packaging structure. The sensor packaging structure discussedherein may reduce (or eliminate) moisture from interfering from theoperations of the sensor.

FIGS. 1A through 1C illustrate sensor packaging structures according tovarious aspects. FIG. 1A illustrates a sensor packaging structure 100,and FIG. 1B illustrates the sensor packaging structure 100 with asealing material 114. Referring to FIGS. 1A and 1B, the sensor packagingstructure 100 included a sensor die 102, a bonding material 104, and atransparent material 106. The bonding material 104 couples the sensordie 102 to the transparent material 106. In some examples, the sensorpackaging structure 100 is a sensor chip scale package. In someexamples, the sensor packaging structure 100 is a complementarymetal-oxide-semiconductor (CMOS) image sensor chip scale package.

In some examples, the sensor die 102 includes an image sensor die. Insome examples, the sensor die 102 is configured to convertelectromagnetic radiation (e.g., light) to electrical signals. In someexamples, the sensor die 102 includes, or corresponds with, an array ofpixels. In some examples, the sensor die 102 includes a CMOS imagesensor. In some examples, the bonding material 104 includes an adhesivematerial. In some examples, the bonding material 104 includes apolymer-based material. In some examples, the bonding material 104includes an epoxy resin. In some examples, the transparent material 106includes a material that allows electromagnetic radiation (e.g., light(e.g., visible light)) to pass through (e.g., pass through the entiretyof the material). In some examples, the transparent material 106includes an optically transparent material that allows the transmissionof light waves without being scattered (or being scattered to arelatively small or negligible degree). In some examples, thetransparent material 106 includes an organic material. In some examples,the transparent material 106 includes an inorganic material. In someexamples, the transparent material 106 includes one or more organicmaterials and/or one or more inorganic materials. In some examples, thetransparent material 106 includes a glass material. In some examples,the transparent material 106 include one layer of transparent materialor two or more layers of transparent material.

As shown in FIG. 1A, the sensor packaging structure 100 includes an edgeportion 108 defining a first interface 110 between the sensor die 102and the bonding material 104, and a second interface 112 between thebonding material 104 and the transparent material 106. The sensor die102 has a sensor edge 116, the bonding material 104 has a bondingmaterial edge 120, and the transparent material 106 has a transparentmaterial edge 122.

As shown in FIG. 1B, the sensor packaging structure 100 includes asealing material 114. The sealing material 114 includes a portion 103that covers (e.g., disposed on) the first interface 110 at the edgeportion 108 of the sensor packaging structure 100. The sealing material114 may include a portion 105 that is disposed on and extends along atleast a portion of the sensor edge 116 of the sensor die 102. Thesealing material 114 may include a portion 109 this is disposed on andextends across at least a portion of the bonding material edge 120 ofthe bonding material 104. In some examples, the sealing material 114includes a portion that is disposed on at least a portion of a surface118 of the sensor die 102. The sealing material 114 may help to reduce(or prevent) moisture from entering into the sensor packaging structure100 by covering the first interface 110 between the sensor die 102 andthe bonding material 104 at the edge portion 108 of the sensor packagingstructure 100.

In some examples, the sealing material 114 includes a metal layer. Themetal layer may include one metal layer or more than one metal layer.The metal layer may include one or more metal layers from aluminum (Al),titanium (Ti), tantalum (Ta), copper (CU), gold (Au), and/or nickel(Ni). In some examples, the sealing material 114 includes a metal layerand a passivation layer. In some examples, the passivation layerincludes a solder mask material. In some examples, the passivation layerincludes a SiO_(x)N_(y)C_(x) material, where x is greater or equal to 0,and y is greater or equal to 0. In some examples, the passivation layeris disposed on the sensor edge 116, the first interface 110, and thebonding material edge 120, and the metal layer is disposed on thepassivation layer.

FIG. 1C illustrates a sensor packaging structure 150 according toanother aspect. The sensor packaging structure 150 includes the samecomponents as shown in FIGS. 1A and 1B, but the sealing material 114extends across the second interface 112. For example, as shown in FIGS.1A and 1C, the sealing material 114 may have a portion 111 that coversor is disposed on the second interface 112 between the bonding material104 and the transparent material 106. The sealing material 114 may havea portion 113 that is disposed on and extends along at least a portionof the transparent material edge 122. In some examples, the sealingmaterial 114 is disposed on the entire length of the transparentmaterial edge 122.

FIG. 2A illustrates a transparent material 206 with multiple layers, andFIG. 2B illustrates a sealing material 214 disposed across the multiplelayers according to an aspect. The transparent material 206 may be anexample of the transparent material 106 of FIGS. 1A through 1C. Thesealing material 214 may include any of the features discussed withreference to the sealing material 114 of FIGS. 1A through 1C. Thetransparent material 206 may include a first layer 231, a second layer232, and a third layer 233. The first layer 231, the second layer 232,and the third layer 233 may include the same transparent material. Insome examples, at least one of the first layer 231, the second layer232, and the third layer 233 includes a transparent material that isdifferent from the other layers. The first layer 231 defines a firstedge 222, the second layer 232 defines a second edge 226, and the thirdlayer 233 defines a third edge 230. The transparent material 206 definesa first interface 224 between the first layer 231 and the second layer232 at an edge portion 208 of the transparent material 206, and a secondinterface 228 between the second layer 232 and the third layer 233 atthe edge portion 208. In some applications, moisture may enter throughthe first interface 224 and/or the second interface 228.

However, the sealing material 214 is disposed over the interfaces of thetransparent material 206 to reduce (or eliminate) moisture from enteringinto the sensor packaging structure and interfering with operations ofthe sensor. The sealing material 214 includes a portion 221 disposed onand extending along the first edge 222 of the first layer 231, a portion223 that is disposed on the first interface 224, a portion 225 disposedon and extending along the second edge 226 of the second layer 232, aportion 227 disposed on the second interface 228, and a portion 229disposed on and extending along at least a portion of the third edge 230of the third layer 233. In some examples, the sealing material 214extends along the entire length of the third edge 230.

FIG. 3A illustrates a sensor packaging structure 300 having a sensor die302 coupled to a transparent material 306 with a bonding material 304using a cavity wall design, and FIG. 3B illustrates the sensor packagingstructure 300 with a sealing material 314 disposed along an edge portion308 of the sensor packaging structure 300. As shown in FIGS. 3A and 3B,portions of the bonding material are removed to define gaps 345 betweenthe bonding material 304. The sensor packaging structure 300, the sensordie 302, the transparent material 306, the bonding material 304, and thesealing material 314 may include any one or more of the featuresexplained with reference to FIGS. 1A through 2B. In some examples, thesealing material 314 may be disposed on any of the interfaces betweenthe sensor die 302, the bonding material 304, and the transparentmaterial 306 at the edge portion 308 of the sensor packaging structure300.

The sensor die 302 may define a sensor edge 316, the bonding material304 may define a bonding material edge 320, and the transparent material306 may define a transparent material edge 322. The sensor packagingstructure 300 may include a first interface 310 between the sensor die302 and the bonding material 304, and a second interface 312 between thebonding material 304 and the transparent material 306. The sealingmaterial 314 may include a portion 305 that is disposed on and extendsalong the sensor edge 316 of the sensor die 302, a portion 303 that isdisposed on the first interface 310, a portion 309 that is disposed onand extends along the bonding material edge 320, a portion 311 that isdisposed on the second interface 312, and a portion 313 that is disposedon and extends along at least a portion of the transparent material edge322. In some examples, the sealing material 314 extends along the entirelength of the transparent material edge 322. In some examples, thesensor packaging structure 300 includes a gapless design in which thebonding material 304 extends from edge to edge of the sensor packagingstructure 300 (e.g., without the gaps 345). In some examples, the sensorpackaging structure 100 or the sensor packaging structure 150 includes agapless design.

FIG. 3C illustrates a sensor packaging structure 350 having a sensor die302 coupled to a transparent material 306, and FIG. 3D illustrates thesensor packaging structure 350 with a sealing material 314 disposedalong an edge portion 308 of the sensor packaging structure 300. Thesensor packaging structure 300, the sensor die 302, the transparentmaterial 306, and the sealing material 314 may include any one or moreof the features explained with reference to FIGS. 1A through 3B. In someexamples, the transparent material 306 is coupled to the sensor die 302without the use of a bonding material. In some examples, the sealingmaterial 314 may be disposed on any of the interfaces between the sensordie 302 and the transparent material 306.

The sensor die 302 may define a sensor edge 316, and the transparentmaterial 306 may define a transparent material edge 322. The sensorpackaging structure 300 may include an interface 331 between the sensordie 302 and the transparent material 306. The sealing material 314 mayinclude a portion 305 that is disposed on and extends along the sensoredge 316 of the sensor die 302, a portion 303 that is disposed on theinterface 331, and a portion 309 that is disposed on and extends alongat least a portion of the transparent material edge 322. In someexamples, the sealing material 314 extends along the entire length ofthe transparent material edge 322.

FIG. 4A illustrates a sensor packaging structure 400, and FIG. 4Billustrates an edge portion 408 of the sensor packaging structure 400that includes a sealing material 414 applied on the edge portion 408according to an aspect.

Referring to FIG. 4A, the sensor packaging structure 400 includes asensor die 402, a bonding material 404, and a transparent material 406.The sensor die 402 includes a pixel array that is configured to receivelight and generate electrical signals based on the received light, andmay include any of the characteristics described herein. In someexamples, the sensor die 402 includes an image sensor. In some examples,the sensor die 402 includes a CMOS mage sensor. The sensor die 402includes a first surface 446 and a second surface 448 disposed oppositeto the first surface 446. In some examples, the first surface 446 isdisposed in parallel with respect to the second surface 448. Thedistance between the first surface 446 and the second surface 448 maydefine a thickness of the sensor die 402 in the direction A1. The activeregion (e.g., where the pixel elements are disposed) may be defined onthe second surface 448. The sensor packaging structure 400 may includeconductive components 444 coupled to the first surface 446 of the sensordie 402. In some examples, the conductive components 444 aresurface-mount packaging elements. In some examples, the conductivecomponents 444 include solder balls. The conductive components 444 arecomponents used to connect to an external device (e.g., a ball gridarray (BGA) device). However, the conductive components 444 may includeother types of surface-mount packaging elements.

The second surface 448 of the sensor die 402 is disposed in a plane A4.A direction A1 is aligned perpendicular to the plane A4, and a directionA2 is perpendicular to the direction A1. A direction A3 into the page(shown as a dot) is aligned parallel to the plane A4 and is orthogonalto directions A1 and A2. The directions A1, A2, and A3, and plane A4,are used throughout several of the various views of the implementationsdescribed throughout the figures for simplicity.

The sensor die 402 may include one or more vias 442. For example, thevias 442 may extend through the sensor die 402 in a direction A1. Forexample, the vias 442 may extend through the first surface 446 and thesecond surface 448 in the direction A1. In some examples, as shown inFIG. 4A, the vias 442 are tapered towards the second surface 448 of thesensor die 402. Each via 442 may be a vertical interconnect access thatextends in the A1 direction. Each via 442 may include a hole lined witha conductive material.

The sensor die 402 is coupled to the transparent material 406 using thebonding material 404. For example, the bonding material 404 is disposedbetween the sensor die 402 and the transparent material 406 at the edgeportion 408. In some examples, the bonding material 404 includes apolymer-based adhesive material, and may include any of thecharacteristics discussed herein. In some examples, an empty space 445is defined between a portion of the sensor die 402 and a portion of thetransparent material 406. In some examples, the bonding material 404defines a dam member 411 at each edge portion 408 of sensor packagingstructure 400. The dam members 411 couple the sensor die 402 to thetransparent material 406 in a manner that positions a first surface 452of the transparent material 406 away from the second surface 448 of thesensor die 402.

The transparent material 406 includes the first surface 452 and a secondsurface 454 disposed opposite to the first surface 452, and may includeany of the characteristics discussed herein. In some examples, thesecond surface 454 is disposed in parallel with the first surface 452.In some examples, the distance between the first surface 452 and thesecond surface 454 may define a thickness of the transparent material406 in the direction A1. In some examples, the transparent material 406includes an organic material. In some examples, the transparent material406 includes an inorganic material. In some examples, the transparentmaterial 406 includes one or more organic materials and/or one or moreinorganic materials. In some examples, the transparent material 406includes a glass material. In some examples, the transparent material406 include one layer of transparent material or two or more layers oftransparent material.

At the edge portion 408, as shown in FIG. 4B, the sensor packagingstructure 400 defines a first interface 410 between the sensor die 402and the bonding material 404. In some examples, the first interface 410is an area where the sensor die 402 contacts the bonding material 404 atthe edge portion 408. The sensor die 402 includes a sensor edge 416. Thesensor edge 416 may be disposed between and extend from the firstsurface 446 of the sensor die 402 to the second surface 448 of thesensor die 402 in the direction A1. In some examples, the sensor edge416 may be disposed at a non-zero angle with respect to the directionA1. In some examples, the sensor edge 416 is disposed in parallel withthe direction A1. In some examples, the sensor edge 416 is linear. Insome examples, the sensor edge 416 includes one or more bent or curvedportions.

The bonding material 404 includes a bonding material edge 420. Thebonding material edge 420 may be disposed between a top (or first)surface of the bonding material 404 and a bottom (or second) surface(disposed opposite to the first surface) of the bonding material 404.The first surface of the bonding material 404 may be substantiallyparallel with the first surface 446 or the second surface 448 of thesensor die 416, and the second surface of the bonding material 404 maybe substantially parallel with the first surface 452 of the transparentmaterial 406 or the second surface 454 of the transparent material 406.In some examples, the distance between the first surface of the bondingmaterial 404 and the second surface of the bonding material 404 maydefine a thickness of the bonding material 404 in the direction A1. Insome examples, the bonding material edge 420 may include a first edgeportion 423 that extends from the first interface 410 along a portion ofthe bonding material edge 420. In some examples, the first edge portion423 is disposed at a non-zero angle with respect to the direction A1.The bonding material edge 420 may include a second edge portion 425 thatextends in a direction A2. The bonding material edge 420 may include athird edge portion 427 that extends in the direction A1.

The sealing material 414 includes a passivation layer 417 and a metallayer 419. The metal layer 419 may include one or more metal layers fromaluminum (Al), titanium (Ti), tantalum (Ta), copper (CU), gold (Au),and/or nickel (Ni). In some examples, the passivation layer 417 includesa solder mask material. In some examples, the passivation layer 417includes a SiO_(x)N_(y)C_(x) material, where x is greater or equal to 0,and y is greater or equal to 0. In some examples, the passivation layer417 also extends along the first surface 446 of the sensor die 402 andthe vias 442. In some examples, the metal layer 419 is only applied onthe edge portion 408.

The sealing material 414 includes a portion 405 that is disposed on andextends along the sensor edge 416, a portion 403 that is disposed on thefirst interface 410, and a portion 409 that is disposed on and extendsalong at least a portion of the bonding material edge 420. In someexamples, the portion 405 of the sealing material 414 extends the entirelength of the sensor edge 416. In some examples, the portion 405 of thesealing material 414 extends along only a portion of the sensor edge416. In some examples, the sealing material 414 disposed on a surfaceportion 421 of the bonding material 404, where the surface portion 421is disposed in a plane that is parallel to the direction A2. In someexamples, the sealing material 414 is disposed on the first edge portion423 of the bonding material edge 420. In some examples, the sealingmaterial 414 is disposed on the second edge portion 425 of the bondingmaterial edge 420. In some examples, the sealing material 414 is notdisposed on the third edge portion 427 of the bonding material edge 420.

FIG. 5 illustrates an edge portion 508 of a sensor packaging structurehaving a sealing material 514 that is applied on the edge portion 508according to another aspect. The edge portion 508 may be another exampleof an edge portion of the sensor packaging structure 400 of FIG. 4A, andmay include one or more of the features discussed with reference toFIGS. 4A and 4B.

As shown in FIG. 5, the edge portion 508 includes a sensor die 502coupled to a transparent material 506 using a bonding material 504. Thesensor die 502, the bonding material 504, and the transparent material506 may include any of the features discussed with reference to theprevious figures. The sensor die 502 includes a first surface 546 and asecond surface 548, and the transparent material 506 includes a firstsurface 552 and a second surface 554. The bonding material 504 isdisposed between the second surface 548 of the sensor die 502 and thefirst surface 552 of the transparent material 506. The edge portion 508includes a first interface 510 disposed between the sensor die 502 andthe bonding material 504, and a second interface 512 disposed betweenthe bonding material 504 and the transparent material 506. The sensordie 502 includes a sensor edge 516 disposed between and/or extendingbetween the first surface 546 of the sensor die 502 and the secondsurface 548 of the sensor die 502. In some examples, the sensor edge 516is disposed at an angle with respect to the direction A1. In someexamples, the sensor edge 516 includes one or more portions that aredisposed in parallel with the direction A1. In some examples, the sensoredge 516 is linear. In some examples, the sensor edge 516 includes oneor more bent or curved portions.

The bonding material 504 includes a bonding material edge 520 thatextends between the first interface 510 and the second interface 512. Insome examples, the bonding material edge 520 includes one or moreportions that are disposed at a non-zero angle with respect to thedirection A1. In some examples, the bonding material edge 520 includesone or more portions that are disposed in parallel with the directionA1. The transparent material 506 includes a transparent material edge522 that is disposed between and/or extends from the first surface 552of the transparent material 506 to the second surface 554 of thetransparent material 506.

The sealing material 514 may include any of the features explained withreference to the previous figures. For example, the sealing material 514may include a passivation layer 517 and a metal layer 519. The sealingmaterial 514 may include a portion 505 that is disposed on and extendsalong the sensor edge 516, a portion 503 that is disposed on the firstinterface 510, a portion 509 that is disposed on and extends along thebonding material edge 520, a portion 511 that is disposed on the secondinterface 512, and a portion 513 that extends along a portion of thetransparent material edge 522.

FIGS. 6A and 6B illustrate a flowchart 600 depicting example fabricationoperations for manufacturing a sensor packaging structure having asealing material according to an aspect. Although the flowchart 600 isdescribed with reference to the sensor packaging structure 400 of FIGS.4A and 4B, the flowchart 600 may be applicable to any of the sensorpackaging structures discussed herein. Although the flowchart 600 ofFIGS. 6A and 6B illustrates operations in sequential order, it will beappreciated that this is merely an example, and that additional oralternative operations may be included. Further, operations of FIGS. 6Aand 6B and related operations may be executed in a different order thanthat shown, or in a parallel or overlapping fashion.

Operation 602 includes providing the sensor die 402 (e.g., a sensorwafer) and the transparent material 406 with the bonding material 404.Operation 604 includes bonding the sensor die 402 to the transparentmaterial 406 using the bonding material 404. Operation 606 includeswafer level thinning on the sensor die 402. Operation 608 includesthrough via etching to form the vias 442. Operation 610 includespre-cutting the bonding material 404. Operation 612 including performingpassivation on exposed bottom surfaces of the sensor die 402 and thebonding material 404. Operation 614 includes performing passivation openon exposed bottom surfaces of the sensor die 402 and the bondingmaterial 404. Operations 616 and 618 include metal depositing, andoperation 620 includes metal patterning that includes coupling theconductive components 444. Operation 622 includes metal patterning toslice the package, and operation 624 includes providing the sensorpackaging structure 400.

FIG. 7 illustrate a flowchart 700 depicting example fabricationoperations for manufacturing a sensor packaging structure having asealing material according to an aspect. The flowchart 700 may beapplicable to any of the sensor packaging structures discussed herein.Although the flowchart 700 of FIG. 7 illustrates operations insequential order, it will be appreciated that this is merely an example,and that additional or alternative operations may be included. Further,operations of FIG. 7 and related operations may be executed in adifferent order than that shown, or in a parallel or overlappingfashion.

Operation 702 includes coupling a sensor die to transparent materialusing a bonding material. Operation 704 includes processing the sensordie including forming one or more vias through the sensor die. Operation706 includes disposing a sealing material on at least one of a firstinterface or a second interface, where the first interface is betweenthe sensor die and the bonding material, and the second interface isbetween the bonding material and the transparent material. In someexamples, the disposing the sealing material includes disposing apassivation layer on at least one of the first interface or the secondinterface, and disposing a metal layer on the passivation layer.

It will be understood that, in the foregoing description, when anelement is referred to as being connected to, electrically connected to,coupled to, or electrically coupled to another element, it may bedirectly connected or coupled to the other element, or one or moreintervening elements may be present. In contrast, when an element isreferred to as being directly connected to or directly coupled toanother element, there are no intervening elements. Although the termsdirectly connected to, or directly coupled to may not be used throughoutthe detailed description, elements that are shown as being directlyconnected or directly coupled can be referred to as such. The claims ofthe application, if any, may be amended to recite exemplaryrelationships described in the specification or shown in the figures.Implementations of the various techniques described herein may beimplemented in (e.g., included in) digital electronic circuitry, or incomputer hardware, firmware, software, or in combinations of them.Portions of methods also may be performed by, and an apparatus may beimplemented as, special purpose logic circuitry, e.g., an FPGA (fieldprogrammable gate array) or an ASIC (application specific integratedcircuit).

Some implementations may be implemented using various semiconductorprocessing and/or packaging techniques. Some implementations may beimplemented using various types of semiconductor processing techniquesassociated with semiconductor substrates including, but not limited to,for example, Silicon (Si), Gallium Arsenide (GaAs), Gallium Nitride(GaN), Silicon Carbide (SiC) and/or so forth.

While certain features of the described implementations have beenillustrated as described herein, many modifications, substitutions,changes and equivalents will now occur to those skilled in the art. Itis, therefore, to be understood that the appended claims are intended tocover all such modifications and changes as fall within the scope of theembodiments. It should be understood that they have been presented byway of example only, not limitation, and various changes in form anddetails may be made. Any portion of the apparatus and/or methodsdescribed herein may be combined in any combination, except mutuallyexclusive combinations. The embodiments described herein can includevarious combinations and/or subcombinations of the functions, componentsand/or features of the different embodiments described.

What is claimed is:
 1. A sensor packaging structure comprising: asubstrate having a first surface, a second surface, and a substrate edgethat extends between the first surface and the second surface; a sensordie having a first surface and a second surface opposite the firstsurface of the sensor die, the sensor die defining a sensor edge thatextends between the first surface of the sensor die and the secondsurface of the sensor die; a bonding material layer coupling the sensordie to the substrate, the bonding material layer having a first surfaceand a second surface opposite the first surface of the bonding materiallayer, the bonding material layer defining a bonding material edge thatextends between the first surface of the bonding material layer and thesecond surface of the bonding material layer; and a sealing materialincluding a passivation layer and a metal layer, the passivation layerincluding a first portion abutting and covering the sensor edge, aportion of the first surface of the bonding material layer, the bondingmaterial edge, and the substrate edge, the metal layer covering thefirst portion of the passivation layer, the passivation layer includinga portion disposed between the metal layer and the substrate edge. 2.The sensor packaging structure of claim 1, wherein the second surface ofthe sensor die includes an active region having pixel elements, whereina plurality of conductive components are coupled to the first surface ofthe sensor die, wherein a second portion of the passivation layer iscoupled to the first surface of the sensor die, wherein the metal layeris not coupled to the second portion of the passivation layer thatextends along the first surface of the sensor die.
 3. The sensorpackaging structure of claim 1, wherein a portion of the substrate edgeis tapered.
 4. The sensor packaging structure of claim 1, wherein thesecond surface of the bonding material layer contacts the first surfaceof the substrate.
 5. The sensor packaging structure of claim 1, whereina distance between the first surface of the substrate and the secondsurface of the substrate defines a thickness of the substrate, thesubstrate being a transparent substrate configured to permit passage oflight.
 6. The sensor packaging structure of claim 1, wherein the firstsurface of the substrate includes a recessed portion, the passivationlayer including a first linear portion coupled to the recessed portionand a second linear portion coupled to the substrate edge, the firstlinear portion being disposed at a non-zero angle with respect to thesecond linear portion.
 7. The sensor packaging structure of claim 1,wherein the sensor die includes one or more tapered vias.
 8. A sensorpackaging structure comprising: a sensor die having a first surface anda second surface, the sensor die defining a sensor edge disposed betweenthe first surface and the second surface; a substrate coupled to thesensor die, the substrate having a first surface and a second surface,wherein a distance between the first surface of the substrate and thesecond surface of the substrate defines a thickness of the substrate,the substrate defining a substrate edge between the first surface of thesubstrate and the second surface of the substrate, the substrate edgeincluding a tapered portion; a bonding material layer disposed betweenthe sensor die and the substrate to couple the sensor die to thesubstrate, the bonding material layer defining a bonding material edgedisposed between a first surface of the bonding material layer and asecond surface of the bonding material layer; and a sealing materialincluding a passivation layer and a metal layer, a first portion of thepassivation layer abutting and covering the sensor edge, a portion ofthe first surface of the bonding material layer, the bonding materialedge, and the tapered portion of the substrate edge, the metal layercovering the first portion of the passivation layer, the passivationlayer including a portion disposed between the metal layer and thetapered portion of the substrate edge.
 9. The sensor packaging structureof claim 8, wherein the sensor edge is tapered.
 10. The sensor packagingstructure of claim 8, wherein the substrate is a glass substrate. 11.The sensor packaging structure of claim 8, wherein the metal layercovers the passivation layer along the substrate edge, the sensor dieedge, and the bonding material edge, wherein the passivation layer isnot covered by the metal layer at the first surface of the sensor die.12. The sensor packaging structure of claim 8, wherein the passivationlayer is coupled to a portion of the first surface of the sensor die.13. The sensor packaging structure of claim 8, wherein the secondsurface of the sensor die includes an active region having pixelelements, wherein the passivation layer extends along a portion of thefirst surface of the sensor die, and the metal layer is not coupled to aportion of the passivation layer that extends along the portion of thefirst surface of the sensor die.
 14. The sensor packaging structure ofclaim 8, wherein the passivation layer includes solder mask materialthat is different from a material of the metal layer.
 15. The sensorpackaging structure of claim 8, wherein the sensor die includes aplurality of tapered vias such that a width of each tapered viadecreases in a direction toward the second surface of the sensor die.16. A sensor packaging structure comprising: a glass substrate having afirst surface and a second surface opposite to the first surface, theglass substrate defining a substrate edge extending between the firstsurface of the glass substrate and the second surface of the glasssubstrate, wherein a distance between the first surface of the glasssubstrate and the second surface of the glass substrate defines athickness of the transparent substrate, the substrate edge including atapered portion; an image sensor die having a first surface and a secondsurface opposite the first surface of the image sensor die, the sensordie defining a sensor edge disposed between the first surface of theimage sensor die and the second surface of the image sensor die, thesecond surface of the image sensor die including an active area, theactive area of the image sensor die configured to receive light throughthe glass substrate; a plurality of conductive components coupled to thefirst surface of the image sensor die, the plurality of conductivecomponents configured to connect to an external device; a bondingmaterial layer coupling the image sensor die to the glass substrate, thebonding material layer having a first surface and a second surfaceopposite the second surface of the bonding material layer, the bondingmaterial layer defining a bonding material edge disposed between thefirst surface of the bonding material layer and the second surface ofthe bonding material layer, the first surface of the bonding materiallayer being coupled to the second surface of the image sensor die, thesecond surface of the bonding material layer being coupled to the firstsurface of the glass substrate; and a sealing material including apassivation layer and a metal layer, the passivation layer abutting andcovering the sensor edge, a portion of the first surface of the bondingmaterial layer, the bonding material edge, the tapered portion of thesubstrate edge, and a portion of the first surface of the image sensordie, the metal layer covering portions of the passivation layer thatextend along the sensor edge, the portion of the first surface of thebonding material layer, the bonding material edge, and the taperedportion of the substrate edge, the metal layer not covering the portionof the passivation layer that extends along the portion of the firstsurface of the image sensor die.
 17. The sensor packaging structure ofclaim 16, wherein the sensor die includes a tapered via such that awidth of the tapered via decreases in a direction toward the secondsurface of the sensor die.